Ball Mil Mixer

wire bonding - ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire.Thermosonic wirebonding with a nominal stage temperature of 150 c and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended.Use the minimum level of ultrasonic energy to achieve reliable wirebonds.